Our manufacturing process has been optimized over three decades of operations, bringing us to the cusp of systems, processes, and human capital that delivers value with every manufacturing run. Today, we are the preferred partners across the electronics manufacturing spectrum in the United States and India. With our state-of-the-art facilities in both countries, we deliver accurate and high-quality bare boards, quick turnaround prototypes, production volume boards, and flush circuits.
Relentless focus on quality, performance, and resilience are at the core of our manufacturing operations. Our talented team is equipped with tested technology systems to ensure an integrated and streamlined electronics manufacturing process under one roof. We offer accelerated lead times to take customer designs to the manufacturing process with direct access to base materials. We have systematically structured a manufacturing platform that is agile enough to support non-standard base materials, allowing you greater room for customization.
Our promise is straightforward:
- On-Time Delivery
- Precision Manufacturing to Mitigate the Risk of Reworks
- Empowering Innovators in the Electronics Ecosystem with Adaptive Manufacturing Processes
- 2 Business Day Turnaround Time for Prototypes & Small Volume Needs
Material in Stock
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Glass Epoxy Laminate
FR 4 Standard Tg,
FR 4 Medium Tg & FR 4 High Tg -
High Frequency & Low Loss Laminate
RT 5880, RT 5870,
RT 4003, RT 4350 & RT 6002, TMM
Special Technologies
- Flush Circuits
- Switch Plates
- Heat Sinks
- Heavy Copper up to 8 Oz.
- Blind/Buried/Plugged Via
- Hardware Installation
- Selective Gold
Technical Capabilities
- Single Side to 24 Layers
- Minimum 5 Mil Line/Spacing
- Board Thickness from 0.002 to 0.250 Inches
- Minimum PTH Hole Size 8 Mil
- Maximum Panel Size 18 inch * 24 Inch
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Offering1 - 20+
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Largest Panel Size18" x 24"
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Smallest Circuit Width/Spacing.005”, .005” proto
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Material TypesPolyimide, PTFE, LPC, FR4, Teflon, Metal-Core, Heat Sinks
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Smallest Mech. Drilled Hole.008"
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Hole Size/Dim. Tolerances+/- .003" and +/- . 002"
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Finishes/Lead FreeHASL, Immersion Silver/ Gold, Hard Gold, PbFree HASL
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Electrical TestingFlying Probe
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FabricationRouting & Scoring, Array Layouts
Materials
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OfferingCapability
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Substrate Minimum Thickness.002"
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Max. Operating Temperature356F
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Maximum Layer Count24+
Fabrication
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OfferingCapability
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Min. Finished Hole Size.006"
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Blind/Buried Vias.005" - .006"
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Routing Tolerance.005"
Imaging
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OfferingCapability
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Min. Lines/ Spaces.005"
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Min. Quad Flat Pack Pitch.020"
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Min. Pad Size.010"
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Solder mask Registration.005"
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Solder mask Tolerance.005"
Plating & Surface Finishes
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OfferingCapability
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Finished Cu Thickness6 oz.
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Hot Air Solder LevelingYes
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Lead-Free Solder (HAL)Yes
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Full Body Hard Ni/AUYes
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Immersion Gold/ SilverYes
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OSPYes